富士XPF镜片供应凯拓机电图XPF保护镜片图片

SMT组装工艺与焊接前的每一工艺步骤密切相关，其中包括资金投入、PCB设计、元件可焊性、组装操作、焊剂选择、温度/时间的控制、焊料及晶体结构等。

SMT assembly process are closely associated with each process step before welding, including money, PCB design, component solderability, assembly operation, choice of flux, temperature/time, soldering and the control of crystal structure, etc.

SMT贴片红胶是一种聚稀化合物，与锡膏不同的是其受热后便固化，其凝固点温度为150℃，这时，红胶开始由膏状体直接变成固体。

SMT patch red rubber is a kind of rare compounds, different from the solder paste is heated after curing, its freezing point temperature is 150 ℃, at this point, the red glue started directly by the paste body becomes solid.